Lotus Company utilizes both the Micro/Nano fabrication equipment and MEMS process equipment enabling high-volume and cost-effective MEMS production. Our mission is to provide an expert micro/nano-fabrication service and consultancy for research laboratories and corporates. We can develop customized solutions for your needs in the field of Micro/Nano fabrication.

Customized Solutions In The Field of Micro/Nano Fabrication

We provide end-to-end support, from design through installation and continuing maintenance. Our equipment utilizes the highest quality vacuum and electronic components for long-term reliable operation with minimal maintenance.

Our Products

Thermal Evaporation System

Thermal evaporation is a common method of physical vapor deposition (PVD). It is one of the simplest forms of PVD and typically uses a resistive heat source to evaporate a solid material in a vacuum environment to form a thin film. The material is heated in a high vacuum chamber until vapor pressure is produced.

Sputtering system

Sputtering is a plasma-based deposition process in which energetic ions are accelerated towards a target. The ions strike the target and atoms are ejected (or sputtered) from the surface. These atoms travel towards the substrate and incorporate into the growing film

ICP based-Deep Reactive Ion Etching System (ICP-DRIE)

Deep reactive ion etching (DRIE) technology is one of the most important technologies in the processing of microelectronic devices and microelectromechanical system. As a necessary process in semiconductor integration, it has been widely studied in the past decades. It is known that the traditional DRIE process typically uses a plasma etching reactor equipped with inductively coupled plasma (ICP) sources to generate a high-density plasma so as to achieve high aspect ratio trenches with relatively small roughness. related cost, especially for those applications that do not have extremely stringent requirement on the final etching accuracy.

Diffusion and Oxidation Furnace

Diffusion furnaces are used for applications that require sustained, high temperatures at moderate vacuum. This could include thermal oxide growth, doping, and dopant diffusion. Typically, these furnaces are quite large and can accommodate a large quantity of substrates. Thermal oxide growth on silicon is carried out at very high temperatures accompanied by the flow of oxygen containing gas. Oxides grown this way are very high quality in terms of dielectric and morphological properties.

Reactive Ion Etching System

Reactive-ion etching is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure by an electromagnetic field.

Mask Aligner System

This machine is what actually transfers the pattern onto the wafer. A mask is placed above the wafer. The mask has the desired pattern on it. A high intensity ultraviolet light is placed over the mask. The light only transmits through the openings in the pattern allowing the pattern is burned into the photoresist on the wafer.

Our Future Products

Low Pressure Chemical Vapor Deposition

Low pressure chemical vapor deposition (LPCVD) is a chemical vapor deposition technology that uses heat to initiate a reaction of a precursor gas on the solid substrate. This reaction at the surface is what forms the solid phase material. Low pressure (LP) is used to decrease any unwanted gas phase reactions, and also increases the uniformity across the substrate.

Mask Writer

Mask writing is a key step in this process. Mask makers use two types of tools—e-beams and laser-based pattern generators. Laser-based systems pattern the larger features and non-critical layers, while e-beam tools are used to pattern the smallest features and the most critical layers on the mask.